Vibration isolating device

ABSTRACT

A vibration isolating device for isolating an object from at least one of vibration and shock from an external source. The vibration isolation device comprises such features as a mounting structure where the object is mounted to, at least a plurality of first springs coupled to the mounting structure to minimize coupling of the at least one vibration and shock to the object, and a shock stop. In addition, the device may include a plurality of stop pins that are separate from the mounting structure and arranged externally to the mounting structure. The stop pins can limit a displacement of the object when the at least one of vibration and shock exceeds a given level.

FIELD OF THE INVENTION

This invention relates generally to vibration-reducing techniques, andmore particularly, to a device for isolating an object from vibrationsand/or shocks, and further, for protecting other object(s) in a vicinityof the object subjected to vibrations and/or shocks.

BACKGROUND

Mechanical hard drives, CD-ROMS, DVD-ROMS, etc. are some of examples ofmany objects that contain mechanically sensitive parts. When subjectedto vibrations or shocks from external sources, such objects may sufferfrom a degraded performance or even a complete failure.

Often, vibration-sensitive objects are located within a larger system(e.g., a computer, a moving vehicle, a machinery, etc.), and thus becomesusceptible to vibrational disturbances and shocks external to thesystem or generated by other components within the system. Moreparticularly, vibrations and/or shocks external to the system orgenerated by other components within a system itself could betransmitted to the object, potentially causing undesirable effects, suchas performance degradation or a movement of the object.

In this regard, a sufficiently strong vibration or shock could displacethe object to the point of “bumping” against other adjacent objects.Some shock or vibrations could be of such high magnitudes that damage toone or both of the objects may be inevitable.

Unfortunately, current vibration isolating systems may not be able toeffectively isolate an object from external vibrations and/or shocks,and also minimize displacement of the object such as to protect systemcomponents from a potential damage.

SUMMARY

Advantageously, the present invention provides a vibration isolatingdevice to isolate an object, such as a hard disk drive, from vibrationand/or a shock that may come from an external source. Further, thevibration isolating device comprises features to protect the object andadjacent object(s) from damage that otherwise may result from a contactof the object with the adjacent object(s) in the presence of vibrationand/or shock.

In one illustrative embodiment, the vibration isolating device comprises(i) a mounting structure having an area for mounting the object thereon,(ii) a plurality of first springs coupled to the mounting structure andoperative to minimize coupling of the at least one vibration and shockto the object, (iii) a shock stop separate from the mounting structurecomprising a first shock-absorbing material, and (iv) a plurality ofstop pins separate from the mounting structure and arranged externallyabout the mounting structure, the plurality of stop pins operative tolimit a displacement of the object when the at least one vibration andshock exceeds a given level. The vibration isolating device may furthercomprise a plurality of second springs that are operative to furtherminimize coupling of the at least one vibration and shock to the object.

These as well as other aspects and advantages will become apparent tothose of ordinary skill in the art by reading the following detaileddescription, with reference where appropriate to the accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The device, in accordance with one or more embodiments, is described indetail with reference to the following drawings. The drawings areprovided for purposes of illustration only and merely depict typical orexample embodiments. These drawings are provided to facilitate thereader's understanding and shall not be considered limiting of thebreadth, scope, or applicability of the disclosure. It should be notedthat for clarity and ease of illustration these drawings are notnecessarily made to scale.

FIG. 1 is a perspective view of the vibration isolating device inaccordance with an embodiment of the present invention;

FIG. 2 is an end view of the vibration isolating device in accordancewith an embodiment of the present invention;

FIG. 3 is a perspective view of the vibration isolating device inaccordance with an embodiment of the present invention with an objectinstalled thereon;

FIG. 4 is an end view of the vibration isolating device, includingobject 120 in accordance with an embodiment of the present invention;

FIG. 5 is a bottom view of the vibration isolation device in accordancewith an embodiment of the present invention;

FIG. 6 is a bottom view of an embodiment of the vibration isolationdevice in proximity to adjacent objects; and

FIG. 7. is a perspective view of the bottom of the vibration isolationdevice in accordance with an embodiment of the present invention.

Some of the figures included herein illustrate various embodiments fromdifferent viewing angles. Although the accompanying descriptive text mayrefer to such views as “top,” “bottom” or “side” views, such referencesare merely descriptive and do not imply or require that the embodimentbe implemented or used in a particular spatial orientation unlessexplicitly stated otherwise.

The figures are not intended to be exhaustive or limited to the preciseform disclosed. It should be understood that the invention can bepracticed with modification and alteration, and that it is limited onlyby the claims and the equivalents thereof.

DETAILED DESCRIPTION

FIG. 1 illustrates a perspective view of a vibration isolating device 10according to one illustrative embodiment. As shown in FIG. 1, vibrationisolating device 10 generally includes a mounting structure 20, aplurality of first springs, such as bottom springs 30, coupled tomounting structure 20, and stop pins 40 and shock stop 50 that areseparate from the mounting structure and arranged externally to themounting structure.

Bottom springs 30 and shock stop 50 are shown in more detail in FIG. 2depicting a side view of the vibration isolating device of FIG. 1. Asshown in FIGS. 1 and 2, in some embodiments, vibration isolating device10 may further include a plurality of second springs, such as topsprings 60, coupled to the mounting structure and disposed in adirection opposite from the plurality of first springs, such as bottomsprings 30.

As shown in FIG. 2, mounting structure 20 may include a top portion 70and a bottom portion 80. An object to be isolated from a vibrationand/or shock may be mounted onto an area within the top portion 70 ofthe mounting structure. More specifically, as shown in FIG. 1, topportion 70 may include a flat rectangular base 90 onto which the objectcould be mounted. In this regard, the size/surface area of base 90 maybe adjusted accordingly to accommodate a particular object. As shown,each of the top springs 60 and bottom springs 30 is arrangedsubstantially perpendicular to base 90 of the mounting structure.

Further, top portion 70 may include side walls 100 to secure the object,and in some embodiments, may also include side portions 110 (shown inFIG. 2), that in combination with side walls 100, may further secure theobject within the mounting structure. In addition, the object could beattached to top portion 70 by other means, such as screws for example.It should be understood that mounting structure 20 is not confined to arectangular form and could take other forms as well.

FIGS. 3 and 4 illustrate respectively the embodiments of FIGS. 1 and 2,including an object 120. For example, object 120 could be a mechanicalhard disk drive (e.g., an HDD), such as shown in FIG. 4. However, inother embodiments, vibration isolating device 10 may be used to providevibration and shock isolation for a variety of other objects, examplesof which include a DVD-ROM, a CD-ROM, an optics assembly, a laserassembly, a solid state drive, and an LCD assembly.

As shown in FIG. 3, object 120 may be mounted or attached to base 90,where the size of base 90 and side walls 100 may be adjusted to the sizeof object 120, such as to securely hold the object in place. FIG. 4shows an end view of object 120, with side portions 110 that furthersecure the object within mounting structure 20. Such arrangement mayassist in holding the object in place more securely, in the event object120 becomes loosened when subjected to high vibrations and/or shocks.

In general, vibration isolating device 10 may be provided to protectobject 120 when the object is subjected to a vibration and/or shock froman external source. Object 120 could be a standalone object or acomponent of a larger system. Typically, object 120, such as a hard diskdrive for example, would be placed in a larger system (e.g., acomputer). As such, any vibrations and/or shocks applied externally toor experienced by the system, or alternatively, generated by othercomponents within a system itself (e.g., a 60 Hz or 120 Hz noise signalsfrom a power supply, etc.) could be transmitted, or coupled, to object120.

Such vibration or other external forces may cause undesirable effects,such as a mechanical disturbances within object 120 or a movement of theobject. Particularly, when subjected to vibration and/or shock, object120 could be displaced such as to come into contact with other adjacent,or neighboring, objects. Depending on the amplitude (or magnitude) of avibration or shock, the displacement of the object could be substantial,leading to an impact with another object and possible damage to eitherone of the objects.

In one illustrative embodiment, vibration isolating device 10 provides anumber of features to provide isolation from external vibrations and/orshocks to the object 120. In addition, some features of the vibrationisolating device 10 may also provide damage protection to adjacentobjects and/or object 120 that could otherwise result from contactbetween objects in the presence of vibration or shock.

In one aspect, vibration isolating device 10 comprises bottom springs30, coupled to mounting structure 20. As shown, for example, in FIGS. 3and 4, bottom springs 30 may be coupled to bottom portion 80 of themounting structure, and may be operative to minimize coupling, ortransmission, of a vibration and/or shock to object 120. In oneembodiment, vibration isolating device 10 comprises four bottom springs.Each of the bottom springs 30 may include a coil compression spring,such as any suitable helical compressions spring (e.g., a COTS helicalcompression spring). Further, each of the bottom springs 30 may becoupled to mounting structure 10 via a spring holder 130. Preferably,bottom springs 30 will be arranged such as to substantially equally loadeach of the bottom spring. As shown in FIGS. 3 and 4, each of springholders 130 is preferably an integral part of mounting structure (e.g.,formed in the same mold as the mounting structure). However, each ofspring holders 130 may also be a separate part coupled to the mountingstructure 20 by means such as welding, bolting, etc.

It should be noted that one benefit of coupling bottom springs 30 viaholders 130 is that the holders may help to stabilize each spring andlimit deflection and sideways motion of the spring during vibrationand/or shock. In this regard, the depth of each spring holder may beadjusted based on a given application and/or anticipated magnitude ofvibrational/shock disturbance. Note that bottom portion 80 of mountingstructure 20 may be shaped accordingly to accommodate spring holders 130and provide clearance for the bottom springs. As shown in the example ofFIG. 4, bottom portion 80 of the mounting structure 20 could have, forexample, a basin-like shape with slanted sides 140.

Note, however, that it may be possible to couple bottom springs 30 tomounting structure 20 in other ways, such as through the use of suitablespring mounts, snubbers, and the like.

Bottom springs 30 may be disposed on any suitable support or bearingsurface. Preferably, bottom springs 30 will be mounted such thatmounting structure 20 is substantially leveled. In one embodiment, asshown in FIGS. 3 and 4, bottom springs 30 are mounted within bottommounting cups 300 which are disposed onto a surface 150 adjacent toobject 120, such as an adjacent object 160 sitting below object 120.Generally, the ends of helical compression springs 30 are not attachedto bottom cups 300 and springs 30 just “sit” within the bottom mountingcups 300 on surface 150. Alternatively, the spring could be attached tothe surface via any suitable means to hold the spring in place.

In an illustrative embodiment, bottom springs 30 may operate to “absorb”external vibrational and shock excitations to minimize transmission ofsuch excitations to object 120, and thus to isolate object 120 from suchexcitations. Further, bottom springs 30 may prevent object 120 fromcontacting other objects, such as adjacent object 160.

In general, vibration isolation is a function of transmissibility, andis expressed as a percent (I =(1−T)*100)),where transmissibility denotesa ratio of a force transmitted to an object and an input force.Minimizing the amount of vibrations and/or shocks transmitted to object120 will maximize the isolation. To achieve a desired amount ofisolation, various spring parameters may be calculated/selectedaccordingly.

In particular, parameters, such as a spring stiffness (or spring rate),spring diameter, wire diameter, wire material, wire end conditions andspring-free length, etc., may be computed and/or adjusted accordingly tomeet specific isolation design criteria and also to maximize spring lifefor various load conditions, anticipated vibration/shock conditions,etc. The parameters for spring selection can be based on well knownformulas familiar to those skilled in the art. To avoid system failureresulting from improper selection of springs, spring factors for each ofthe springs in the system should be solved simultaneously. Those skilledin the art will appreciate that various available spring simulation orcalculation tools could be used for this purpose.

Although bottom springs 30 may be able to provide a certain degree ofisolation, the present invention provides additional features to furtherisolate object 120 from vibrations and/or shocks. In particular, asnoted above, vibration isolating device 10 may further comprise secondsprings 60, as shown in FIGS. 3 and 4 for example, that are disposed ina direction opposite from bottom springs 30.

In particular, as shown in FIGS. 3 and 4, second springs 60 may becoupled to top portion 70 of mounting structure 20, such as atrespective four corners of base 90. Top springs 60 may be operative tofurther minimize coupling, or transmission, of external vibration and/orshock to object 120, and generally, to further stabilize the object. Inone embodiment, vibration isolating device 10 may comprise four topsprings 60.

Like bottom springs 30, each of top springs 60 may include a coilcompression spring, such as any suitable helical compressions spring(e.g., a COTS helical compression spring). Further, each of the topsprings may be coupled to mounting structure 20 via a spring holder 170.Similarly, as shown in FIG. 4 each top spring 60 will held in place onthe top end by upper spring cup 310. In one example, spring cup 310 ismounted to surface 180 of another object adjacent to object 120, such asan adjacent object 190 sitting above object 120, as shown.

As also shown in FIGS. 3 and 4, each of spring holders 170 willpreferably be an integral part of mounting structure 20 (e.g., formed inthe same mold as the mounting structure). However, each of springholders 170 could also be a separate part coupled to the mountingstructure by any known means, such as welding or bolting. Likewise,spring cups 300 and 310 may form an integral part of objects 160 and 190respectively, or could be mounted to the surfaces 150 and 180 of objects160 and 190 by other means.

One benefit of coupling top springs 60 via holders 170 is that theholders may help to stabilize each spring and limit deflection andsideway motion of the spring during vibrations and/or shocks. In thisregard, a depth of each spring holder may be adjusted based on a givenapplication and/or anticipated level of vibrational/shock disturbance.

It should be noted that while top springs 60 and bottom springs 30 donot need to be attached to adjacent surfaces 180 and 150 respectively,to provide isolation they do need to remain within spring cups 300 and310. It is understood therefore, that spring cups 300 and 310 must be ofsufficient depth to ensure that displacement in the ±z direction due toshock or vibration does not result in springs 30 or 60 falling out oftheir respective spring cups. Furthermore it is understood that thespring cups 300 and 310 can not be too deep to ensure that they do notcontact spring holder cups 130 and 170 respectively during operation.Furthermore as described below with respect to shock stop 50 the depthsof spring cups 300 and 310 must be sized according to the maximumexpected displacement to avoid the springs from coming loose during alarge displacement.

Indeed, when device 10 is oriented as shown in FIG. 4, the forcingfrequency (vibration input) is in the +z and −z axis. Top springs 60 areadvantageously mounted such that they do not ever contact object 190 orsurface 180 while still remaining within spring cups 310. In fact, ithas been shown that if the top springs are allowed to contact surface180, the forcing frequency increases in amplitude greatly. However, whenthe forcing frequency is not directly in the +z and −z axis, then thetop springs 60 act to supply isolation functionality along with thebottom springs 30. This lateral loading of the isolator results in acompletely different spring rate required to effectively isolatewhatever device is mounted to mounting structure 20 since the springsare not in a compression state but rather bending. Isolator 10 allowsupper and lower springs 60 and 30 to bend or buckle, providing theequivalent spring force to springs in compression. It should be apparentto one skilled in the art, that the bending and compression factors mustbe accounted for and considered simultaneously so as not to have aspring failure due to excessive bending stress in the spring wire.

Further, top springs 60 may further limit displacement of object 120 andprevent object 120 from contacting other objects, such as adjacentobject 190, in the presence of external vibrations and/or shocks. Thecombination of top springs 60 and bottom springs 30 effectively minimizedisplacement of the object 120 in both vertical, horizontal, and lateraldirections when subjected to vibration and/or shock inputs along all sixaxes (i.e., ±x-axis, ±y-axis, and ±z-axis). Also, the combination of topsprings 60 and bottom springs 30 may counteract any oscillations thatcould potentially develop in either the bottom or top springs.

When in use, isolating device 10 may be mounted in a variety ofconfigurations and orientations. Accordingly, the isolators must accountfor mounting the end device in any orientation, including upside down.As will be recognized, to achieve a desired amount of isolation, variousspring parameters of top springs 60 and bottom springs 30 may becalculated/selected accordingly. In particular, parameters, such as aspring stiffness (or spring rate), spring diameter, wire diameter, wirematerial, wire end conditions and spring-free length, etc., may becomputed and/or adjusted accordingly to meet specific isolation designcriteria and also to maximize spring life for various load conditions,anticipated vibration/shock conditions, etc. Those skilled in the artwill appreciate that various available spring simulation/calculationtools could be used for this purpose.

In a normal operation, the combination of top springs 60 and bottomsprings 30 may be sufficient to isolate object 120 from a variety ofvibrations of different frequencies and/or shocks transmitted fromexternal source(s). However, the present invention recognizes that insome situations, object 120 could be subjected to external shock signalsof sufficiently high amplitude/magnitude that may not be effectivelyreduced by bottom springs 30 an/or top springs 60, and in effect, couldbe almost entirely or partially coupled to object 120.

As noted above, vibration isolating device 10 works in conjunction withshock stop 50 and shock cup 290. Shock stop 50 may be mounted to surface150 of object 160 and extends perpendicularly upwards from surface 150into shock cup 290 without contacting the sides of shock cup 290 orsurface 340 of mounting plate 20. In one embodiment, shock cup 290 is anintegral part of mounting base 20 although it could be a separatecomponent attached to mounting base 20 by one of several known meanssuch as welding or screwing. Shock cup 290 extends in the −z-directionfrom surface 340 as indicated in FIG. 7 and is formed from protrudingwall 291 shown in FIG. 5. Shock cup 290 should be sufficiently largeenough and deep enough to accommodate shock stop 50 without allowing itto contact the inner walls or surface 340. Shock stop 50 may be coupledto any surface isolated from and opposite to a side on which object 120is mounted. Shock stop 50 is preferably disk-shaped although othergeometries, such as rectangular or oval may be used without impactingthe effective ability of shock stop 50 to dampen shock or vibration. Itshould be further understood, however, that the geometry of shock stop50 impacts the geometry of shock cup 290 and protruding wall 291 andcare should be taken to ensure that the chosen geometries do notinterfere with the isolation performance of device 10.

Shock stop 50 is positioned adjacent to a central area of object 120 (ormounting structure 20). In one embodiment, shock stop 50 is a diskhaving a surface area of at least 20% of a surface area of object 120.The area of the shock stop is not a primary consideration, however, itdoes play a role and is a factor in the design but it can vary greatlybased on the material used for the shock stop and with the amount ofdisplacement that is allowable in the final mounting area of the fullisolation system. Center-mounted shock stop 50 may essentially operateas a damping element to absorb, or dissipate, mechanical (kinetic)energy generated by shock excitation. The width and thickness or areasize of the shock stop 50 varies depending on the material chosen andwith the amount of displacement that is allowable in the final mountingarea of the full isolation system.

In a normal operation, shock stop 50 will be coupled to surface 150which is not in contact with isolator 10 or mounting structure 20. Shockstop 50 extends into shock cup 290, but does not contact surface 340 ofmounting plate 20 or protruding wall 291 until acted on by an externalvibration or shock that exceeds a given level, such as a particularsignal amplitude or magnitude (e.g., at a particular vibrationfrequency) or an amount of force (e.g., a acceleration-based g-force(e.g., a ng/Hz input or ng²/Hz random inputs).

By way of example, referring back to FIG. 4, mounting structure 20holding object 120 could sit above adjacent object 160. Shock stop 50 isconnected to surface 150 of object 160 and does not contact mountingstructure 20 or surface 340 under normal operating conditions. If ashock pulse 200 of sufficiently high amplitude is applied to mountingstructure 20 in the −z axis, bottom springs 30 will be compressedexcessively, and the mounting structure could be displaced from itsnormal position in the −z direction.

In the absence of shock stop 50, mounting structure 20 could contactwith adjacent object 160, potentially resulting in damage to bothobjects 160 and 120. With shock stop 50 in place, however, mechanicalenergy caused by shock pulse 200 can be absorbed and dissipated by shockstop 50. Thus, shock stop 50 essentially acts as a “buffer” betweenobject 120 (or mounting structure 20 holding object 120) and adjacentobject 160 when the shock exceeds a given level in the −z direction,such as the level that cannot be effectively reduced by the springs.

FIG. 7 shows a perspective view of the bottom of an embodiment ofisolator 10 with shock stop 50 omitted. The underside of surface 20 inthis embodiment details integral spring cups 130, shock cup 290, opening295 and surface 340 built into a single structure, while such integratedcomponents may simplify assembly, it is to be understood, that isolator10 can be comprised of component parts held together by any known means,such as welding, bolting, screwing, etc.

As shown in FIGS. 5 and 7, mounting structure 20 may include an opening295 in base structure 20. Opening 295 may act to allow any heatgenerated by device 120 to dissipate. Mounting structure 20 alsocontains a protruding wall 291. Protruding wall 291, as shown in FIG. 5,acts as the surrounding walls of shock cup 290. Shock stop 50 is sizedso as to not contact the inner walls of shock cup 290 or the surface 340of mounting plate 20 in a normal state. It will be understood therefore,that the spacing between the walls of shock cup 290 and shock stop 50serve as what is referred to as “sway space”. The sway space allowsisolator 10 to move freely so it can effectively isolate vibration. Aswill be appreciated by those skilled in the art, that as soon as anycontact is made between isolator 10 and shock stop 50, vibrationisolation ceases to function correctly. Thus, the sway space isapplication specific to a large extent and can be tuned together withthe rest of the system to come up with a desirable or allowabletolerances. The geometry of the shock stop is such that the sway spacesurrounding shock stop 50 and the distance between the top surface ofshock stop 50 and surface 340 of mounting plate 20 are the same.Accordingly, the sway space distance in any combination of axisdisplacement due to shock is equal.

It should be understood therefore that the total potential displacementin the −z direction includes the space between the upper surface ofshock block 50 (the “sway space”) and surface 340 plus any compressionof shock block 50 that may occur. This total potential displacementimpacts the design depths of spring cups 310. As will be understood bythose skilled in the art, the depth of spring cup 310 must be greaterthen the total possible displacement in the −z direction to ensure thatupper springs 60 do not dislocate from within spring cups 310 duringdisplacement in the −z direction. Similarly, it will be furtherappreciated by those skilled in the art, that shock stop 50 can dampenand isolate shock in five of the six axes, it does not however, functionto isolate shocks to isolator 10 in the +z direction as shown in FIG. 4.An additional stop 330 may be placed above object 120 on the surface 180the same distance away from the device to be isolated as the distancebetween surface 340 and the top surface of item 50, thereby allowing forshock dampening equally in all six directions. Total possibledisplacement in the +z direction therefore is the distance between thebottom surface of stop 330 and the top of object 120 plus anycompression of stop 330. This distance, likewise impacts the designdepth of spring cups 300. Spring cups 300 must be deeper then thepotential total displacement in the +z direction to ensure that springs30 do not come loose during a maximum displacement in the +z direction.These distance, like the size of stop block 50 and shock cup 290, areadjustable per application of the isolator.

In an embodiment, shock stop 50 includes material(s) with sufficientlyhigh shock-absorbing properties. Examples of suitable shock-absorbingmaterials include, for example, materials having a Shore A or Shore Drating in the range of 0-70 Durometer. Suitable materials could besilicone, urethane, cellular gel, cellular foam, rubber, or anycombinations thereof or any other suitable material with similar shockratings.

In addition to stop shock 50, vibration isolating device 10 willpreferably comprise additional displacement-limiting features to limitdisplacement of object 120 in the presence of severe vibrations and/orshocks from external source(s). In particular, in an embodiment,vibration isolating device 10 comprises stop pins 40 that are separatefrom mounting structure 20 and arranged externally to the mountingstructure 20.

As shown in FIGS. 3 and 4, for example, stop pins 40 are arrangedexternally to mounting structure 20, such as around the perimeter of themounting structure. As shown in FIG. 4, each stop pin 40 may be adjacentto one respective top spring 60, and may include one or more elongatedmembers 210 and a stop portion 220. Stop pins 40 are preferably directedsubstantially perpendicular to object 120 or base 90 of the mountingstructure 20. Further, one end, such as end 240, of each of the stoppins may be held or attached in a place via any suitable means. The stoppins 40 may be press fit pins that are pressed into the housing (notshown) directly or screwed into the housing in which the isolator isinstalled. This is another variable based on the overall design as notwo applications will have the same critical stop areas or availablespace for the stop pins 40 to be placed.

In a normal operation, mounting structure 20 holding object 120 willpreferably not contact any of stop pins 40 until the vibration or shockexceeds a given level, such as a particular signal amplitude ormagnitude (e.g., at a particular vibration frequency) or an amount offorce (e.g., an acceleration-based g-force (e.g., a ng/Hz input orng²/Hz random inputs)).

Note that the given level at which stop pins 40 operate to limit adisplacement of object 120 could be the same or different from a levelat which shock stop 50 operates to limit the displacement of the object120. Preferably, the sway space associated with shock stop 50 and shockcup 290 is less then the displacement limits imposed by stop pins 40.

As shown in FIG. 4, each stop portion 220 could have a cylindrical shapealthough other shapes such as hexagonal or other geometries could beused. This feature helps to minimize contact surface area when mountingstructure 20 holding object 120 comes in contact with any of stop pins40. Additionally, as noted above, each stop pin 40 may be adjacent toone respective top spring 60, or its corresponding spring holder 170. Inthis regard, as shown in FIGS. 3 and 5, spring holders 170 or mountingstructure 20 may have curved portions 230.

One advantage of this feature is that when a contact occurs, the stoppin 40 may not only limit any further movement of object 120, but mayalso allow mounting structure 20 to “slide” against the stop pin,preventing potentially undesirable jerks. Further, each stop portion 220may comprise a shock-absorbing material such that the stop portion 220may operate as a damping element to absorb, or dissipate, mechanicalenergy generated due to vibration or shock excitation when the contactoccurs.

In this regard, each stop portion 220 will preferably includematerial(s) with sufficiently high shock-absorbing absorbing properties.Examples of suitable shock-absorbing materials include, for example,materials having a Shore A or Shore D rating in the range of 0-70Durometer. Suitable materials could be silicone, urethane, cellular gel,cellular foam, rubber, or any combinations thereof or other materialswith similar shock-absorbing properties.

In addition, the curved features of each of spring holders 170 mayassist stop pins 40 in limiting a displacement of object 120, such asalong different axes of travel.

By way of example, referring to FIG. 6, during vibration or a shockpulse of sufficiently high amplitude, stop pins 40 a and 40 b togetherwith curve portions 230 a and 230 b could limit displacement of object120 along −y axis to prevent contact with an adjacent object 280. Stoppins 40 b and 40 c together with curve portions 230 b and 230 c couldlimit displacement of object 120 along -x-axis to prevent contact withan adjacent object 270. Then, stop pins 40 c and 40 d together withcurve portions 230 c and 230 d could limit displacement of object 120along +y axis to prevent contact with an adjacent object 260. Similarly,stop pins 40 d and 40 a together with curved portions 230 d and 230 acould limit displacement of object 120 along +x-axis to prevent contactwith an adjacent object 250. (Note that the above example is providedfor illustration purposes only, and particular axis of orientation,directions of travel, etc. are only illustrative).

In effect, each curved portion 230 and adjacent stop pin 40 couldoperate to limit displacement of object 120 for two axes of travel.Further, in general, stop pins 40 could essentially act as a “buffer”between object 120 (or mounting structure 20 holding object 120) and anyadjacent object(s) when vibration and/or shock exceeds a given level,such as the level that cannot be effectively reduced by the springs.Note that spring holders 170 could be sized/shaped and spacedaccordingly for a given application and/or anticipated magnitude ofvibrational/shock disturbance. Similarly, stop pins 40, which areindependent from mounting structure 20, could be arbitrarily sized (e.g.by selecting a given size of cylindrical stop portion 220) and spacedaround the mounting structure as well, such as based on a givenapplication and/or anticipated magnitude of vibrational/shockdisturbance. Further, in other embodiments, stop pins 40 could beshaped/structured in different ways from those described above.

The amount of force required for the isolator to contact the shock stopand/or the over stop pins is specific to each application of theisolator system as the mass of the system varies. In one example, thedisclosed system was able to protect against both a 30G 18 ms and a 50G11 ms shock pulse input.

While various embodiments have been described above, it should beunderstood that they have been presented by way of example only, and notof limitation. Likewise, the various diagrams may depict an examplearchitectural or other configurations and is intended to aid inunderstanding the features and functionality that can be included. Theinvention is not restricted to the illustrated example architectures orconfigurations, but the desired features can be implemented using avariety of alternative architectures and configurations. Indeed, it willbe apparent to one of skill in the art how alternative functional,logical or physical partitioning and configurations can be implementedto implement the desired features of the present inventions.

Although, described in terms of various exemplary embodiments andimplementations, it should be understood that the various features,aspects and functionality described in one or more of the individualembodiments are not limited in their applicability to the particularembodiment with which they are described, but instead can be applied,alone or in various combinations, to one or more of the otherembodiments, whether or not such embodiments are described and whetheror not such features are presented as being a part of a describedembodiment. Thus the breadth and scope of the present disclosure shouldnot be limited by any of the above-described exemplary embodiments.

Terms and phrases used in this document, and variations thereof, unlessotherwise expressly stated, should be construed as open ended as opposedto limiting. As examples of the foregoing: the term “including” shouldbe read as meaning “including, without limitation” or the like; the term“example” is used to provide exemplary instances of the item indiscussion, not an exhaustive or limiting list thereof; the terms “a” or“an” should be read as meaning “at least one,” “one or more” or thelike; and adjectives such as “conventional,” “traditional,” “normal,”“standard,” “known” and terms of similar meaning should not be construedas limiting the item described to a given time period or to an itemavailable as of a given time, but instead should be read to encompassconventional, traditional, normal, or standard technologies that may beavailable or known now or at any time in the future. Likewise, wherethis document refers to technologies that would be apparent or known toone of ordinary skill in the art, such technologies encompass thoseapparent or known to the skilled artisan now or at any time in thefuture.

A group of items linked with the conjunction “and” should not be read asrequiring that each and every one of those items be present in thegrouping, but rather should be read as “and/or” unless expressly statedotherwise. Similarly, a group of items linked with the conjunction “or”should not be read as requiring mutual exclusivity among that group, butrather should also be read as “and/or” unless expressly statedotherwise. Furthermore, although items, elements or components of theinvention may be described or claimed in the singular, the plural iscontemplated to be within the scope thereof unless limitation to thesingular is explicitly stated.

As will become apparent to one of ordinary skill in the art afterreading this document, the illustrated embodiments and their variousalternatives can be implemented without confinement to the illustratedexamples. For example, the diagrams and their accompanying descriptionsshould not be construed as mandating a particular architecture, geometryor configuration.

1-28. (canceled)
 29. A vibration isolating device, comprising: amounting structure having an area for mounting an object thereon; aplurality of first springs coupled to the mounting structure andoperative to reduce coupling of a vibration to the object; a shock stopin proximity to a side of the mounting structure opposite to the objectand operative to limit a displacement of the object when the vibrationexceeds a level; and a shock cup attached to the mounting structure,wherein the shock stop extends into the shock cup such that a sway spaceis established between walls of the shock cup and side surfaces of theshock stop and between a top surface of the shock stop and the side ofthe mounting structure opposite to the object.
 30. The device of claim29 further comprising: a second stop mounted to a surface above themounting structure, operative to limit displacement of the object in the+z-direction.
 31. The device of claim 30, wherein the second stop ispositioned such that a first distance between the top surface of theshock stop and the side of the mounting structure opposite to theobject, is equal to a second distance between the second stop and theobject.
 32. The device of claim 29, further comprising: a plurality offirst spring cups mounted to a first adjacent surface that is oppositethe plurality of first springs, wherein each of the plurality of firstsprings is held within one of the plurality of first spring cups withoutmaking contact with the first adjacent surface.
 33. The device of claim32, further comprising a plurality of second springs coupled to themounting structure opposite the plurality of first springs; and aplurality of second spring cups mounted to a second adjacent surfacethat is opposite the plurality of second springs, wherein each of theplurality of second springs is held within one of the plurality ofsecond spring cups without making contact with the second adjacentsurface.